BRCF016GWZ-3E2 Rohm Semiconductor WL-CSP EEPROM
Integraallülitused (IC-d)
Tootja number:
BRCF016GWZ-3E2
Tootja:
Tootekategooria:
Kirjeldus:
WL-CSP EEPROM
RoHs olek:

Andmetabelid:
Juurdepääsu aeg :
-
Kella sagedus :
-
Mälu liides :
-
Mälu suurus :
-
Mälu tüüp :
-
Mälu vorming :
-
Osa olek :
Active
Paigaldustüüp :
Surface Mount
Pakend/ümbris :
4-XFBGA, CSPBGA
Pakendamine :
Tape & Reel (TR)
Pinge – toide :
-
seeria :
Tarnija seadmepakett :
UCSP30L1
Tehnoloogia :
-
Töötemperatuur :
-
Tsükli aja kirjutamine – sõna, leht :
-
Laos
19,919
Ühiku hind:
Võtke meiega ühendust Pakkumine
BRCF016GWZ-3E2 Konkurentsivõimelised hinnad
ChipIcil on ainulaadne tarneallikas. Pakume oma klientidele BRCF016GWZ-3E2 konkurentsivõimelise hinnaga. Saate nautida meie parimat teenust, ostes ChipIc BRCF016GWZ-3E2. Parima hinna saamiseks saidil BRCF016GWZ-3E2 võtke meiega ühendust.
Hinnapakkumise saamiseks klõpsake
BRCF016GWZ-3E2 Iseärasused
BRCF016GWZ-3E2 is produced by Rohm Semiconductor, belongs to Mälu.
BRCF016GWZ-3E2 Toote üksikasjad
:
BRCF016GWZ-3E2 – Mälu disainitud puhvervõimendid ja toodetud Rohm Semiconductor.
BRCF016GWZ-3E2, mida pakub Rohm Semiconductor, saab osta CHIPMLCC-st.
Siit leiate erinevaid juhtivate tootjate elektroonilisi osi rahu.
CHIPMLCC BRCF016GWZ-3E2 on range kvaliteedikontrolliga ja nõuetele vastav kõike nõuetele.
CHIPMLCC-s näidatud fondi staatus on ainult viitamiseks.
Kui te ei leia otsitavat osa, võtke meiega ühendust lisateavet, näiteks varude arvu andmetabelis BRCF016GWZ-3E2 (PDF), hind BRCF016GWZ-3E2, Pinout BRCF016GWZ-3E2, manuaal BRCF016GWZ-3E2 Ja BRCF016GWZ-3E2 asenduslahendus.
BRCF016GWZ-3E2, mida pakub Rohm Semiconductor, saab osta CHIPMLCC-st.
Siit leiate erinevaid juhtivate tootjate elektroonilisi osi rahu.
CHIPMLCC BRCF016GWZ-3E2 on range kvaliteedikontrolliga ja nõuetele vastav kõike nõuetele.
CHIPMLCC-s näidatud fondi staatus on ainult viitamiseks.
Kui te ei leia otsitavat osa, võtke meiega ühendust lisateavet, näiteks varude arvu andmetabelis BRCF016GWZ-3E2 (PDF), hind BRCF016GWZ-3E2, Pinout BRCF016GWZ-3E2, manuaal BRCF016GWZ-3E2 Ja BRCF016GWZ-3E2 asenduslahendus.
BRCF016GWZ-3E2 FAQ
:
1. What is the maximum operating temperature for the BRCF016GWZ-3E2 semiconductor device?
The maximum operating temperature for the BRCF016GWZ-3E2 semiconductor device is 150°C.
2. What is the typical forward voltage drop for the BRCF016GWZ-3E2 at a current of 10A?
The typical forward voltage drop for the BRCF016GWZ-3E2 at a current of 10A is 0.72V.
3. What is the recommended mounting torque for the BRCF016GWZ-3E2 semiconductor module?
The recommended mounting torque for the BRCF016GWZ-3E2 semiconductor module is 0.6 Nm.
4. Can the BRCF016GWZ-3E2 be used in high-frequency applications?
Yes, the BRCF016GWZ-3E2 can be used in high-frequency applications due to its low switching losses.
5. What is the maximum junction temperature for the BRCF016GWZ-3E2 under transient conditions?
The maximum junction temperature for the BRCF016GWZ-3E2 under transient conditions is 175°C.
6. Does the BRCF016GWZ-3E2 require a heat sink for operation?
Yes, the BRCF016GWZ-3E2 requires a heat sink for efficient heat dissipation during operation.
7. What is the typical reverse recovery time for the BRCF016GWZ-3E2 at a junction temperature of 125°C?
The typical reverse recovery time for the BRCF016GWZ-3E2 at a junction temperature of 125°C is 35ns.
8. Is the BRCF016GWZ-3E2 suitable for automotive power applications?
Yes, the BRCF016GWZ-3E2 is suitable for automotive power applications due to its rugged construction and high reliability.
9. What is the maximum allowable junction-to-case thermal resistance for the BRCF016GWZ-3E2?
The maximum allowable junction-to-case thermal resistance for the BRCF016GWZ-3E2 is 0.45°C/W.
10. Can the BRCF016GWZ-3E2 withstand high surge currents?
Yes, the BRCF016GWZ-3E2 can withstand high surge currents due to its robust design and low on-state voltage drop.
The maximum operating temperature for the BRCF016GWZ-3E2 semiconductor device is 150°C.
2. What is the typical forward voltage drop for the BRCF016GWZ-3E2 at a current of 10A?
The typical forward voltage drop for the BRCF016GWZ-3E2 at a current of 10A is 0.72V.
3. What is the recommended mounting torque for the BRCF016GWZ-3E2 semiconductor module?
The recommended mounting torque for the BRCF016GWZ-3E2 semiconductor module is 0.6 Nm.
4. Can the BRCF016GWZ-3E2 be used in high-frequency applications?
Yes, the BRCF016GWZ-3E2 can be used in high-frequency applications due to its low switching losses.
5. What is the maximum junction temperature for the BRCF016GWZ-3E2 under transient conditions?
The maximum junction temperature for the BRCF016GWZ-3E2 under transient conditions is 175°C.
6. Does the BRCF016GWZ-3E2 require a heat sink for operation?
Yes, the BRCF016GWZ-3E2 requires a heat sink for efficient heat dissipation during operation.
7. What is the typical reverse recovery time for the BRCF016GWZ-3E2 at a junction temperature of 125°C?
The typical reverse recovery time for the BRCF016GWZ-3E2 at a junction temperature of 125°C is 35ns.
8. Is the BRCF016GWZ-3E2 suitable for automotive power applications?
Yes, the BRCF016GWZ-3E2 is suitable for automotive power applications due to its rugged construction and high reliability.
9. What is the maximum allowable junction-to-case thermal resistance for the BRCF016GWZ-3E2?
The maximum allowable junction-to-case thermal resistance for the BRCF016GWZ-3E2 is 0.45°C/W.
10. Can the BRCF016GWZ-3E2 withstand high surge currents?
Yes, the BRCF016GWZ-3E2 can withstand high surge currents due to its robust design and low on-state voltage drop.
BRCF016GWZ-3E2 Seotud märksõnad
:
BRCF016GWZ-3E2 Hind
BRCF016GWZ-3E2 Maalimine
BRCF016GWZ-3E2 Tihvtide pinge
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