VB027SP-E STMicroelectronics IC COIL DRIVER PAR 10POWERSO
Integraallülitused (IC-d)
Tootja number:
VB027SP-E
Tootja:
Tootekategooria:
Kirjeldus:
IC COIL DRIVER PAR 10POWERSO
RoHs olek:

Andmetabelid:
Funktsioonid :
Status Flag
Liides :
Parallel
Lüliti tüüp :
General Purpose
Osa olek :
Obsolete
Pakend/ümbris :
PowerSO-10 Exposed Bottom Pad
Pakendamine :
Tube
Pinge – koormus :
4.5 V ~ 5.5 V
Pinge – toide (Vcc/Vdd) :
Not Required
Praegune – väljund (maksimaalne) :
8A
Rds sees (tüüp) :
-
seeria :
VIPower™
Sisendtüüp :
Non-Inverting
Suhe – sisend:väljund :
1:1
Tarnija seadmepakett :
10-PowerSO
Töötemperatuur :
-40°C ~ 150°C (TJ)
Väljundi konfiguratsioon :
Low Side
Väljundi tüüp :
Bipolar
Väljundite arv :
1
Veakaitse :
Over Temperature
Laos
56,270
Ühiku hind:
Võtke meiega ühendust Pakkumine
VB027SP-E Konkurentsivõimelised hinnad
ChipIcil on ainulaadne tarneallikas. Pakume oma klientidele VB027SP-E konkurentsivõimelise hinnaga. Saate nautida meie parimat teenust, ostes ChipIc VB027SP-E. Parima hinna saamiseks saidil VB027SP-E võtke meiega ühendust.
Hinnapakkumise saamiseks klõpsake
VB027SP-E Iseärasused
VB027SP-E is produced by STMicroelectronics, belongs to PMIC – toitejaotuslülitid, koormuse draiverid.
VB027SP-E Toote üksikasjad
:
VB027SP-E – PMIC – toitejaotuslülitid, koormuse draiverid disainitud puhvervõimendid ja toodetud STMicroelectronics.
VB027SP-E, mida pakub STMicroelectronics, saab osta CHIPMLCC-st.
Siit leiate erinevaid juhtivate tootjate elektroonilisi osi rahu.
CHIPMLCC VB027SP-E on range kvaliteedikontrolliga ja nõuetele vastav kõike nõuetele.
CHIPMLCC-s näidatud fondi staatus on ainult viitamiseks.
Kui te ei leia otsitavat osa, võtke meiega ühendust lisateavet, näiteks varude arvu andmetabelis VB027SP-E (PDF), hind VB027SP-E, Pinout VB027SP-E, manuaal VB027SP-E Ja VB027SP-E asenduslahendus.
VB027SP-E, mida pakub STMicroelectronics, saab osta CHIPMLCC-st.
Siit leiate erinevaid juhtivate tootjate elektroonilisi osi rahu.
CHIPMLCC VB027SP-E on range kvaliteedikontrolliga ja nõuetele vastav kõike nõuetele.
CHIPMLCC-s näidatud fondi staatus on ainult viitamiseks.
Kui te ei leia otsitavat osa, võtke meiega ühendust lisateavet, näiteks varude arvu andmetabelis VB027SP-E (PDF), hind VB027SP-E, Pinout VB027SP-E, manuaal VB027SP-E Ja VB027SP-E asenduslahendus.
VB027SP-E FAQ
:
1. Q: What is the maximum operating temperature for the VB027SP-E semiconductor?
A: The maximum operating temperature for the VB027SP-E semiconductor is 150°C.
2. Q: What is the typical forward voltage drop for the VB027SP-E at a current of 10mA?
A: The typical forward voltage drop for the VB027SP-E at a current of 10mA is 0.7V.
3. Q: Can the VB027SP-E handle reverse voltages? If so, what is the maximum reverse voltage it can withstand?
A: Yes, the VB027SP-E can handle reverse voltages. The maximum reverse voltage it can withstand is 50V.
4. Q: What is the typical junction capacitance of the VB027SP-E at a reverse bias of 5V?
A: The typical junction capacitance of the VB027SP-E at a reverse bias of 5V is 15pF.
5. Q: Is the VB027SP-E suitable for high-frequency applications?
A: Yes, the VB027SP-E is suitable for high-frequency applications due to its low junction capacitance and fast switching characteristics.
6. Q: What is the typical reverse recovery time of the VB027SP-E at a forward current of 20mA?
A: The typical reverse recovery time of the VB027SP-E at a forward current of 20mA is 4ns.
7. Q: Does the VB027SP-E require any special handling or storage conditions?
A: The VB027SP-E should be stored in a dry environment with a temperature range of -55°C to 150°C. It should also be handled with proper ESD precautions.
8. Q: What is the typical leakage current of the VB027SP-E at a reverse voltage of 30V?
A: The typical leakage current of the VB027SP-E at a reverse voltage of 30V is 1μA.
9. Q: Can the VB027SP-E be used in parallel to increase current handling capability?
A: Yes, the VB027SP-E can be used in parallel to increase current handling capability, but proper thermal management should be considered.
10. Q: What is the recommended soldering temperature and duration for the VB027SP-E?
A: The recommended soldering temperature for the VB027SP-E is 260°C for 10 seconds, and proper soldering techniques should be followed to prevent damage to the semiconductor.
A: The maximum operating temperature for the VB027SP-E semiconductor is 150°C.
2. Q: What is the typical forward voltage drop for the VB027SP-E at a current of 10mA?
A: The typical forward voltage drop for the VB027SP-E at a current of 10mA is 0.7V.
3. Q: Can the VB027SP-E handle reverse voltages? If so, what is the maximum reverse voltage it can withstand?
A: Yes, the VB027SP-E can handle reverse voltages. The maximum reverse voltage it can withstand is 50V.
4. Q: What is the typical junction capacitance of the VB027SP-E at a reverse bias of 5V?
A: The typical junction capacitance of the VB027SP-E at a reverse bias of 5V is 15pF.
5. Q: Is the VB027SP-E suitable for high-frequency applications?
A: Yes, the VB027SP-E is suitable for high-frequency applications due to its low junction capacitance and fast switching characteristics.
6. Q: What is the typical reverse recovery time of the VB027SP-E at a forward current of 20mA?
A: The typical reverse recovery time of the VB027SP-E at a forward current of 20mA is 4ns.
7. Q: Does the VB027SP-E require any special handling or storage conditions?
A: The VB027SP-E should be stored in a dry environment with a temperature range of -55°C to 150°C. It should also be handled with proper ESD precautions.
8. Q: What is the typical leakage current of the VB027SP-E at a reverse voltage of 30V?
A: The typical leakage current of the VB027SP-E at a reverse voltage of 30V is 1μA.
9. Q: Can the VB027SP-E be used in parallel to increase current handling capability?
A: Yes, the VB027SP-E can be used in parallel to increase current handling capability, but proper thermal management should be considered.
10. Q: What is the recommended soldering temperature and duration for the VB027SP-E?
A: The recommended soldering temperature for the VB027SP-E is 260°C for 10 seconds, and proper soldering techniques should be followed to prevent damage to the semiconductor.
VB027SP-E Seotud märksõnad
:
VB027SP-E Hind
VB027SP-E Maalimine
VB027SP-E Tihvtide pinge
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