MC50XSD200BEKR2 NXP USA Inc. IC SWITCH HISD 36V DUAL 32SOIC
Integraallülitused (IC-d)
Tootja number:
MC50XSD200BEKR2
Tootja:
Tootekategooria:
Kirjeldus:
IC SWITCH HISD 36V DUAL 32SOIC
RoHs olek:
Pliivaba / RoHS-iga ühilduv Andmetabelid:
MC50XSD200BEKR2 Andmetabelid(PDF)
Funktsioonid :
Slew Rate Controlled
Liides :
SPI
Lüliti tüüp :
General Purpose
Osa olek :
Active
Pakend/ümbris :
32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Pakendamine :
Tape & Reel (TR)
Pinge – koormus :
8 V ~ 36 V
Pinge – toide (Vcc/Vdd) :
3.3 V ~ 5 V
Praegune – väljund (maksimaalne) :
1.2A
Rds sees (tüüp) :
50 mOhm
seeria :
-
Sisendtüüp :
-
Suhe – sisend:väljund :
1:1
Tarnija seadmepakett :
32-SOIC EP
Töötemperatuur :
-40°C ~ 125°C (TA)
Väljundi konfiguratsioon :
High Side
Väljundi tüüp :
N-Channel
Väljundite arv :
2
Veakaitse :
Open Load Detect, Over Temperature
Laos
47,227
Ühiku hind:
Võtke meiega ühendust Pakkumine
MC50XSD200BEKR2 Konkurentsivõimelised hinnad
ChipIcil on ainulaadne tarneallikas. Pakume oma klientidele MC50XSD200BEKR2 konkurentsivõimelise hinnaga. Saate nautida meie parimat teenust, ostes ChipIc MC50XSD200BEKR2. Parima hinna saamiseks saidil MC50XSD200BEKR2 võtke meiega ühendust.
Hinnapakkumise saamiseks klõpsake
MC50XSD200BEKR2 Iseärasused
MC50XSD200BEKR2 is produced by NXP USA Inc., belongs to PMIC – toitejaotuslülitid, koormuse draiverid.
MC50XSD200BEKR2 Toote üksikasjad
:
MC50XSD200BEKR2 – PMIC – toitejaotuslülitid, koormuse draiverid disainitud puhvervõimendid ja toodetud NXP USA Inc..
MC50XSD200BEKR2, mida pakub NXP USA Inc., saab osta CHIPMLCC-st.
Siit leiate erinevaid juhtivate tootjate elektroonilisi osi rahu.
CHIPMLCC MC50XSD200BEKR2 on range kvaliteedikontrolliga ja nõuetele vastav kõike nõuetele.
CHIPMLCC-s näidatud fondi staatus on ainult viitamiseks.
Kui te ei leia otsitavat osa, võtke meiega ühendust lisateavet, näiteks varude arvu andmetabelis MC50XSD200BEKR2 (PDF), hind MC50XSD200BEKR2, Pinout MC50XSD200BEKR2, manuaal MC50XSD200BEKR2 Ja MC50XSD200BEKR2 asenduslahendus.
MC50XSD200BEKR2, mida pakub NXP USA Inc., saab osta CHIPMLCC-st.
Siit leiate erinevaid juhtivate tootjate elektroonilisi osi rahu.
CHIPMLCC MC50XSD200BEKR2 on range kvaliteedikontrolliga ja nõuetele vastav kõike nõuetele.
CHIPMLCC-s näidatud fondi staatus on ainult viitamiseks.
Kui te ei leia otsitavat osa, võtke meiega ühendust lisateavet, näiteks varude arvu andmetabelis MC50XSD200BEKR2 (PDF), hind MC50XSD200BEKR2, Pinout MC50XSD200BEKR2, manuaal MC50XSD200BEKR2 Ja MC50XSD200BEKR2 asenduslahendus.
MC50XSD200BEKR2 FAQ
:
1. What is the maximum operating temperature for the MC50XSD200BEKR2 semiconductor?
The maximum operating temperature for the MC50XSD200BEKR2 semiconductor is 150°C.
2. What is the typical forward voltage drop for the MC50XSD200BEKR2 at a current of 10A?
The typical forward voltage drop for the MC50XSD200BEKR2 at a current of 10A is 1.2V.
3. Can the MC50XSD200BEKR2 handle reverse voltages? If so, what is the maximum reverse voltage it can withstand?
Yes, the MC50XSD200BEKR2 can handle reverse voltages. The maximum reverse voltage it can withstand is 100V.
4. What is the typical junction-to-case thermal resistance for the MC50XSD200BEKR2?
The typical junction-to-case thermal resistance for the MC50XSD200BEKR2 is 0.5°C/W.
5. Does the MC50XSD200BEKR2 require a heat sink for operation?
Yes, the MC50XSD200BEKR2 requires a heat sink for operation to ensure proper thermal management.
6. What is the maximum continuous forward current rating for the MC50XSD200BEKR2?
The maximum continuous forward current rating for the MC50XSD200BEKR2 is 50A.
7. Is the MC50XSD200BEKR2 suitable for use in automotive applications?
Yes, the MC50XSD200BEKR2 is suitable for use in automotive applications due to its rugged design and high-temperature capabilities.
8. What is the typical reverse recovery time for the MC50XSD200BEKR2?
The typical reverse recovery time for the MC50XSD200BEKR2 is 35ns.
9. Can the MC50XSD200BEKR2 be used in parallel to increase current handling capacity?
Yes, the MC50XSD200BEKR2 can be used in parallel to increase current handling capacity, but proper current sharing measures must be implemented.
10. What is the recommended mounting torque for the MC50XSD200BEKR2 module?
The recommended mounting torque for the MC50XSD200BEKR2 module is 0.8 Nm.
The maximum operating temperature for the MC50XSD200BEKR2 semiconductor is 150°C.
2. What is the typical forward voltage drop for the MC50XSD200BEKR2 at a current of 10A?
The typical forward voltage drop for the MC50XSD200BEKR2 at a current of 10A is 1.2V.
3. Can the MC50XSD200BEKR2 handle reverse voltages? If so, what is the maximum reverse voltage it can withstand?
Yes, the MC50XSD200BEKR2 can handle reverse voltages. The maximum reverse voltage it can withstand is 100V.
4. What is the typical junction-to-case thermal resistance for the MC50XSD200BEKR2?
The typical junction-to-case thermal resistance for the MC50XSD200BEKR2 is 0.5°C/W.
5. Does the MC50XSD200BEKR2 require a heat sink for operation?
Yes, the MC50XSD200BEKR2 requires a heat sink for operation to ensure proper thermal management.
6. What is the maximum continuous forward current rating for the MC50XSD200BEKR2?
The maximum continuous forward current rating for the MC50XSD200BEKR2 is 50A.
7. Is the MC50XSD200BEKR2 suitable for use in automotive applications?
Yes, the MC50XSD200BEKR2 is suitable for use in automotive applications due to its rugged design and high-temperature capabilities.
8. What is the typical reverse recovery time for the MC50XSD200BEKR2?
The typical reverse recovery time for the MC50XSD200BEKR2 is 35ns.
9. Can the MC50XSD200BEKR2 be used in parallel to increase current handling capacity?
Yes, the MC50XSD200BEKR2 can be used in parallel to increase current handling capacity, but proper current sharing measures must be implemented.
10. What is the recommended mounting torque for the MC50XSD200BEKR2 module?
The recommended mounting torque for the MC50XSD200BEKR2 module is 0.8 Nm.
MC50XSD200BEKR2 Seotud märksõnad
:
MC50XSD200BEKR2 Hind
MC50XSD200BEKR2 Maalimine
MC50XSD200BEKR2 Tihvtide pinge
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