CY7C1568KV18-550BZXI Cypress Semiconductor Corp IC SRAM 72MBIT 550MHZ 165FBGA
Integraallülitused (IC-d)
Tootja number:
CY7C1568KV18-550BZXI
Tootja:
Tootekategooria:
Kirjeldus:
IC SRAM 72MBIT 550MHZ 165FBGA
RoHs olek:
Pliivaba / RoHS-iga ühilduv Andmetabelid:
CY7C1568KV18-550BZXI Andmetabelid(PDF)
Juurdepääsu aeg :
-
Kella sagedus :
550MHz
Mälu liides :
Parallel
Mälu suurus :
72Mb (4M x 18)
Mälu tüüp :
Volatile
Mälu vorming :
SRAM
Osa olek :
Active
Paigaldustüüp :
Surface Mount
Pakend/ümbris :
165-LBGA
Pakendamine :
Tray
Pinge – toide :
1.7 V ~ 1.9 V
seeria :
-
Tarnija seadmepakett :
165-FBGA (13x15)
Tehnoloogia :
SRAM - Synchronous, DDR II+
Töötemperatuur :
-40°C ~ 85°C (TA)
Tsükli aja kirjutamine – sõna, leht :
-
Laos
26,042
Ühiku hind:
Võtke meiega ühendust Pakkumine
CY7C1568KV18-550BZXI Konkurentsivõimelised hinnad
ChipIcil on ainulaadne tarneallikas. Pakume oma klientidele CY7C1568KV18-550BZXI konkurentsivõimelise hinnaga. Saate nautida meie parimat teenust, ostes ChipIc CY7C1568KV18-550BZXI. Parima hinna saamiseks saidil CY7C1568KV18-550BZXI võtke meiega ühendust.
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CY7C1568KV18-550BZXI Iseärasused
CY7C1568KV18-550BZXI is produced by Cypress Semiconductor Corp, belongs to Mälu.
CY7C1568KV18-550BZXI Toote üksikasjad
:
CY7C1568KV18-550BZXI – Mälu disainitud puhvervõimendid ja toodetud Cypress Semiconductor Corp.
CY7C1568KV18-550BZXI, mida pakub Cypress Semiconductor Corp, saab osta CHIPMLCC-st.
Siit leiate erinevaid juhtivate tootjate elektroonilisi osi rahu.
CHIPMLCC CY7C1568KV18-550BZXI on range kvaliteedikontrolliga ja nõuetele vastav kõike nõuetele.
CHIPMLCC-s näidatud fondi staatus on ainult viitamiseks.
Kui te ei leia otsitavat osa, võtke meiega ühendust lisateavet, näiteks varude arvu andmetabelis CY7C1568KV18-550BZXI (PDF), hind CY7C1568KV18-550BZXI, Pinout CY7C1568KV18-550BZXI, manuaal CY7C1568KV18-550BZXI Ja CY7C1568KV18-550BZXI asenduslahendus.
CY7C1568KV18-550BZXI, mida pakub Cypress Semiconductor Corp, saab osta CHIPMLCC-st.
Siit leiate erinevaid juhtivate tootjate elektroonilisi osi rahu.
CHIPMLCC CY7C1568KV18-550BZXI on range kvaliteedikontrolliga ja nõuetele vastav kõike nõuetele.
CHIPMLCC-s näidatud fondi staatus on ainult viitamiseks.
Kui te ei leia otsitavat osa, võtke meiega ühendust lisateavet, näiteks varude arvu andmetabelis CY7C1568KV18-550BZXI (PDF), hind CY7C1568KV18-550BZXI, Pinout CY7C1568KV18-550BZXI, manuaal CY7C1568KV18-550BZXI Ja CY7C1568KV18-550BZXI asenduslahendus.
CY7C1568KV18-550BZXI FAQ
:
1. What is the maximum operating frequency of CY7C1568KV18-550BZXI?
The maximum operating frequency of CY7C1568KV18-550BZXI is 550 MHz.
2. What is the typical power consumption of CY7C1568KV18-550BZXI?
The typical power consumption of CY7C1568KV18-550BZXI is 1.8V core voltage at 550 MHz, with a typical power consumption of 3.6W.
3. What is the operating temperature range of CY7C1568KV18-550BZXI?
CY7C1568KV18-550BZXI has an operating temperature range of -40°C to 125°C.
4. What are the features of CY7C1568KV18-550BZXI's memory architecture?
CY7C1568KV18-550BZXI features a 36-Mbit QDR II+ SRAM with separate I/Os for read and write operations, providing high-speed data throughput.
5. What is the package type of CY7C1568KV18-550BZXI?
CY7C1568KV18-550BZXI comes in a 165-ball FBGA (Fine-pitch Ball Grid Array) package.
6. What are the key benefits of using CY7C1568KV18-550BZXI in high-performance applications?
CY7C1568KV18-550BZXI offers high speed, low latency, and high bandwidth, making it ideal for high-performance networking and telecommunications applications.
7. Does CY7C1568KV18-550BZXI support on-die termination (ODT)?
Yes, CY7C1568KV18-550BZXI supports on-die termination (ODT) for improved signal integrity and reduced system cost.
8. Can CY7C1568KV18-550BZXI operate at different output drive strengths?
Yes, CY7C1568KV18-550BZXI supports programmable output drive strengths to optimize signal integrity and power consumption.
9. What tools are available for designing with CY7C1568KV18-550BZXI?
Cypress provides a comprehensive set of design tools, including IBIS models, layout guidelines, and application notes, to assist in designing with CY7C1568KV18-550BZXI.
10. Is CY7C1568KV18-550BZXI compliant with industry standards?
CY7C1568KV18-550BZXI is compliant with JEDEC standards for QDR II+ SRAM, ensuring interoperability and ease of integration into existing systems.
The maximum operating frequency of CY7C1568KV18-550BZXI is 550 MHz.
2. What is the typical power consumption of CY7C1568KV18-550BZXI?
The typical power consumption of CY7C1568KV18-550BZXI is 1.8V core voltage at 550 MHz, with a typical power consumption of 3.6W.
3. What is the operating temperature range of CY7C1568KV18-550BZXI?
CY7C1568KV18-550BZXI has an operating temperature range of -40°C to 125°C.
4. What are the features of CY7C1568KV18-550BZXI's memory architecture?
CY7C1568KV18-550BZXI features a 36-Mbit QDR II+ SRAM with separate I/Os for read and write operations, providing high-speed data throughput.
5. What is the package type of CY7C1568KV18-550BZXI?
CY7C1568KV18-550BZXI comes in a 165-ball FBGA (Fine-pitch Ball Grid Array) package.
6. What are the key benefits of using CY7C1568KV18-550BZXI in high-performance applications?
CY7C1568KV18-550BZXI offers high speed, low latency, and high bandwidth, making it ideal for high-performance networking and telecommunications applications.
7. Does CY7C1568KV18-550BZXI support on-die termination (ODT)?
Yes, CY7C1568KV18-550BZXI supports on-die termination (ODT) for improved signal integrity and reduced system cost.
8. Can CY7C1568KV18-550BZXI operate at different output drive strengths?
Yes, CY7C1568KV18-550BZXI supports programmable output drive strengths to optimize signal integrity and power consumption.
9. What tools are available for designing with CY7C1568KV18-550BZXI?
Cypress provides a comprehensive set of design tools, including IBIS models, layout guidelines, and application notes, to assist in designing with CY7C1568KV18-550BZXI.
10. Is CY7C1568KV18-550BZXI compliant with industry standards?
CY7C1568KV18-550BZXI is compliant with JEDEC standards for QDR II+ SRAM, ensuring interoperability and ease of integration into existing systems.
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